Compostable plastic from nanoengineered PLA to meet demand of high-temperature thermoforming packaging

23-Nov-07
Compostable plastic from nanoengineered polylactic acid (PLA) has been designed to meet the demands of high-temperature thermoforming packaging. This high-temperature resistant CP-TH-6000 is being marketed by Cereplast at a price lower than conventional styrenic thermoformed resin. Standalone PLA has a heat resistance of about 105°F (44°C), while the new engineered resin from Cereplast incorporates nanotechnology and a patented process that allows it to reach up to 155°F (68°C). CP-TH-6000 meets ASTM 6400, an international standard for compostable materials, he claimed. Cereplast now offers 15 different grades of resins in its compostable range of plastics, a bid to cover all the various packaging needs on the market, stated Frederic Scheer, the company's chairman and chief executive.
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