DSM Engineering Plastics has announced the development of PA4T, a new polymer which extends the portfolio for high performance engineering thermoplastics.
New PA4T offers an exciting and unique balance of properties including excellent dimensional stability, compatibility with lead free soldering, high stiffness and mechanical strength at elevated temperatures, high melting point, and excellent processability in terms of flow and processing window. The new polymer will answer to market trends for miniaturization and convergence of electronic devices like cell phones and computers. It will assist automakers in continued weight reduction efforts for better fuel efficiency and lower costs.
According to Roelof Westerbeek, Global Business Director, Stanyl®: "PA4T materials are highly suitable for electronics applications such as memory card connectors, CPU sockets, high temperature bobbins, and notebook computer memory module connectors, based on its excellent compatibility in lead free surface mount technology and dimensional stability. In automotive markets, we expect the material to support new developments in under the hood applications relating to automotive electrical systems, air/fuel and powertrain components.
"This is an exciting opportunity for our customers. PA4T is a promising complementary product in our portfolio, which will help them to achieve higher performance in their applications and lower system costs. This development will support green initiatives such as lead free soldering and improved fuel economy."
DSM has filed patents on the new polymer, developed compounds and held initial investigative trials with market leaders for various end uses. Results to date have been impressive and DSM is currently constructing a market development plant at the Chemelot site in Sittard-Geleen, the Netherlands, which will provide quantities of the polymer for pre-marketing. The market development plant will become operational in the first quarter 2008.