DSM Engineering Plastics has launched its new halogen free, flame retardant, high temperature polyamide by the trade name Stanyl® ForTii™ which will extend the portfolio for high performance engineering thermoplastics. As part of the Stanyl family, ForTii (previously announced as PA4T) is claimed by the company to have excellent dimensional stability, compatibility with lead free reflow soldering, highest stiffness and mechanical strength at extreme temperatures for use in electronics and other applications. Due to its broad processing window and high flow, Stanyl ForTii has excellent processability. According to the company, for proven customer applications, the balance of dimensional stability, high mechanical and thermal performance and exceptionally low moisture uptake outpaces those of existing polymers.
The new high performance polymer adds to the Stanyl products and meets market needs for lead free soldered surface mount devices such as circuit boards used in personal computers, as well as the current move towards halogen free electronics. The company says the new polymer facilitates the ongoing trend towards further miniaturization, higher data transfer rates and convergence of electronic devices like cell phones, GPS navigators and computers. Besides, it will also assist automakers and the aerospace industry in continued weight reduction efforts for better fuel efficiency and lower costs.