As the design of semiconductor IC chips continue to become smaller and their data processing capabilities grow, innovative materials are required to meet the changing needs of these industries. Mitsubishi Chemical Advanced Materials are specifically designed to perform in the latest wafer processing and chip testing environments-meeting the strictest requirements for purity and consistency in manufacturing. The complete portfolio consists of products tailored specifically for the various process conditions such as CMP rings, FEOL and BEOL wet process, equipment, vacuum chamber and plasma rich environments, back end test sockets and dry process equipment applications. Whatever your application requirements, Mitsubishi Chemical Advanced Materials has a solution for you.
Mitsubishi Chemical Advanced Materials’ recent focus is on providing cost savings through the usage of proprietary Near Net Shape manufacturing. Given that Semiconductor manufacturing often needs ring shaped solutions, traditional machining of parts often come from square shapes. This results in excess waste of high cost materials and increased machining time. Mitsubishi Chemical Advanced Materials Engineered Solutions Group has developed processing methods to deliver Near Net Shapes without sacrificing quality or consistency. “We’re are seeing more demand for cleaner, more consistent, more highly engineered solutions” says Scott Williams, Mitsubishi Chemical Advanced Materials Director of Global Strategic Marketing. “Our portfolio of solutions is uniquely suited to provide extreme performance and value in today’s challenging semiconductor manufacturing environment.”