BASF is now offering polyphthalamide (PPA) by a new Ultramid® Advanced N grade that is especially suited for connectors post-processed with surface mount technology (SMT). Ultramid® Advanced N2U40G7 shows the ideal balance of high flowability, toughness and flame retardancy. It thus enables miniaturization with thin-wall structures at high power and data throughput in electronic applications. Due to its low moisture uptake and high heat deflection temperature, the BASF PPA is especially suitable for SMT processes in electronics manufacturing as it prevents blistering or changes in dimensions of the processed part. BASF delivers the new PA 9T grade in tailor-made colors of high stability and supports with its proven flame-retardant expertise and material know-how for the SMT process. Because of its exceptional property profile, the new Ultramid® Advanced N grade enhances the robustness, performance and reliability of power and data connectors in consumer electronics such as computers, laptops, servers, smart phones as well as smart household appliances and wearable devices.
Smaller and thinner parts have to be incorporated into even more compact designs to save assembly space while at the same time the power and data flow rates increase. Thus, the requirements on materials used grow, especially with respect to temperature and mechanical properties. BASF new Ultramid® Advanced is especially suited for such applications as it can withstand higher temperatures while maintaining its mechanical strength. It meets the heat distortion temperature above 260°C necessary for SMT which is often applied in electronics manufacturing today. The low moisture uptake of Ultramid® Advanced N2U40G7 guarantees a high dimensional stability and avoids blistering during the SMT process.