New polymer to meet market trends for miniaturization and convergence of electronic devices

29-Sep-07
Royal DSM N.V. has developed a new polymer which extends the portfolio for high performance engineering thermoplastics. PA4T has been developed by DSM Engineering Plastics, the inventor and global market leader in high performance polyamides with Stanyl® 46. The new polymer will answer to market trends for miniaturization and convergence of electronic devices like cell phones and computers. It will assist automakers in continued weight reduction efforts for better fuel efficiency and lower costs. PA4T exhibits an exciting and unique balance of properties including excellent dimensional stability, compatibility with lead free soldering, high stiffness and mechanical strength at elevated temperatures, high melting point, and excellent processability in terms of flow and processing window. Nico Gerardu, member of DSM's Managing Board and responsible for the Performance Materials cluster, is proud of the invention: "It is very special that DSM introduces a new polymer to the market. Polymers started to enter the materials arena at the beginning of the 20th century, around the time that DSM was born. Most of the polymers used today were introduced to the market in the '30's till '60's. After 1980 very few new polymers were introduced. PA4T is the first new polymer to be introduced in the new millennium - which is a true achievement of our research and business people and a true commitment to innovation. This breakthrough innovation fits perfectly with the acceleration of DSM's strategy Vision 2010 - Building on Strengths as announced today, which involves a strong focus on Life Sciences and Materials Sciences." DSM envisions that PA4T materials are highly suitable for electronics applications such as memory card connectors, CPU sockets, high temperature bobbins, and notebook computer memory module connectors, based on its excellent compatibility in lead free surface mount technology and dimensional stability. In automotive markets, DSM expects the material to support new developments in under the hood applications relating to automotive electrical systems, fuel delivery, and cooling components. DSM has filed patents on the new polymer, developed compounds and held initial investigative trials with market leaders for various end uses. Results to date have been impressive and DSM is currently constructing a market development plant at the Chemelot site in Sittard-Geleen, the Netherlands, which will provide quantities of the polymer for pre-marketing. The market development plant will become operational in the first quarter 2008. "This is an exciting opportunity for DSM Engineering Plastics and for our customers, who are being driven for higher performance in their applications and lower system costs delivered to their customers. PA4T is a promising complementary product in our portfolio. This development will support green initiatives such as lead free soldering and improved fuel economy. We are committed to moving as quickly as possible to bring this new material, which addresses these needs, to the market and to extend the number of applications where high performance polyamides can be effective," comments Roelof Westerbeek, Global Business Director High Performance Polyamides at DSM Engineering Plastics.
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