Halogen-free Fortron polyphenylene sulfide offers superior mechanical properties

22-Apr-14

Halogen-free Fortron®polyphenylene sulfide (PPS) CES50 for consumer electronics device housings offers superior mechanical properties over traditional polymer solutions has been unveiled by Celanese Corporation. The commercially available grade is designed to help manufacturers produce thin-wall designed cell phone frames, tablet covers and radio jack connectors without material warpage. “Using Celanese patent pending technology, material scientists developed a solution that meets the latest market demand for lighter, thinner and environmentally responsible consumer electronics applications,” said Kevin Liao, Celanese global consumer electronics marketing manager. “This 40-percent-glass-filled PPS is designed for consumer electronics manufacturers that need an engineered material with superior mechanical properties of less than 900 parts per million chlorine content.” Fortron PPS CES50 can be molded in a cold-mold wall temperature range between 70 degrees Celsius to 90 degrees Celsius (158 degrees Fahrenheit to 194 degrees Fahrenheit) unlike standard grades which require higher mold temperatures. Property profile includes: High Tensile Modulus: reaches more than 13900 megapascals (MPa) for improved thin-wall design processing. Excellent Dimensional Stability: meets high-precision design and assembly requirements. Halogen Free: complies with hazardous substance restrictions and waste directives such as the Restriction of Hazardous Substances Directive (RoHS) and the Waste Electrical and Electronic Equipment Directive (WEEE). Low Moisture Absorption: provides excellent post dimension change because of moisture absorption. Flame Retardant: UL 94 V-0 listed at 0.2 millimeters The Fortron CES50 low chlorine PPS grade complies with International Electrotechnical Commission standards for “halogen-free” materials and maintains all desired properties of standard PPS, including continuous service temperature up to 240 degrees Celsius (464 degrees Fahrenheit); good dimensional stability; inherent flame resistance; excellent resistance to automotive/aircraft fuels and fluids, strong acids and bases (pH 2 to 12); high hardness and stiffness; extremely low creep behavior; low coefficient of linear thermal expansion (CLTE), comparable to aluminum; low water absorption; ease of processing.