Non-brominated, non-chlorinated flame retardant PC film helps E/E OEMs power up for high-end eco protection

A new, breakthrough Lexan polycarbonate (PC) film technology; Lexan EFR film – that delivers non-brominated, non-chlorinated flame retardance (FR) at thinner gauges than flame-retardant polypropylene (FRPP) has been introduced by SABIC Innovative Plastics. This new industry-leading material enables electrical/electronics (E/E) OEMs to create flatter, lighter-weight notebook computers and other electronic devices while significantly reducing material costs, giving them a competitive advantage. The new Lexan EFR film is a top-choice environmental solution that increases the ability of global E/E manufacturers to go beyond current environmental directives by voluntarily eliminating halogenated additives in their products. Lexan EFR polycarbonate-based film offers flame retardance without the use of brominated or chlorinated additives thus meeting the requirements of the European Union’s Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE 2006) directives. Further, these new materials have a full listing in the Underwriters Laboratory (UL) yellow card system. According to UL 94, Lexan EFR film – available in clear and opaque versions – delivers V-0 performance above 380 microns; VTM-0 flame resistance performance down to 125 microns for translucent and 100 microns for opaque materials; and complies with TCO-99 eco label requirements. Compared to FRPP, Lexan EFR film reduces shrinkage by a factor of three, provides significantly higher puncture resistance and tensile strength. These properties make it feasible to use very thin gauges of Lexan EFR film to replace thicker FRPP film without sacrificing performance. Not only do thinner gauges help designers create slimmer and lighter-weight consumer electronics, but down-gauging also lowers total costs by reducing the amount of material required. The new film also provides low moisture absorption, high thermal performance (glass transition temperature of 170ºC) and excellent dielectric strength. Target applications for this material include insulation for printed circuits, printed circuit board, disk drive, keyboard, inverters and adaptors, die-cut spacers, labels and overlays. Electromagnetic interference/radio frequency interference (EMI/RFI) shielding is another important benefit provided by Lexan EFR film. As U.S. and European regulatory agencies continue to tighten restrictions on EMI/RFI emissions, electronic device manufacturers are looking for new shielding solutions to replace metal boxes, conductive paints, plating, metal chassis and conductive polymers that add weight and cost. Lexan EFR film provides a low-cost, lightweight solution for both primary and secondary (problem area) shielding, while maintaining UL recognition. Lexan EFR film can be easily fabricated using thermoforming, embossing, clean-edge die cutting, scoring and bending. The product is available globally in matte/polish and velvet/matte finishes and various gauges between 100 and 762 microns.