New LCP meets needs for ultra-low warpage in thinner electronic part designs

22-Nov-07
A new grade of LCP liquid crystal polymer has been introduced by DuPont™. Zenite® LCP liquid crystal polymer meets needs for ultra-low warpage in the thinner part designs used in ever smaller electronic devices. Typical applications for new Zenite® ZE55201 include electronic connectors, chip sockets and interposers Standard resins that perform perfectly well in thicker parts can produce unacceptable warpage in the emerging generation of low-profile designs. New Zenite® ZE55201 has shown that it can meet the challenge in molding trials and early production experience. The new resin's ultra-low-warp performance is achieved by reducing anisotropic shrinkage. Its flow direction shrinkage is similar to that of a typical 30 percent glass-reinforced LCP, but its cross-flow shrinkage is more than 50 percent lower.
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200 ton Van Dorn high speed injection molding machine

200 ton Van Dorn high speed injection molding machine