New bioplastic composite for electronic applications

11-Apr-07

A new composite that uses the bioplastic PLA with heat conductivity greater than stainless steel, and tackles heat release issues in electronic devices has been introduced by Japanese electronics group NEC Corporation. Used in the housings of electronic products, the material releases the heat generated from electronic parts through whole housing surfaces, and slows down the increase in the temperature of the housings near parts. The high heat composite, carbon fibre is cross linked with a unique biomass-based binder. The creation of a cross-linked structure of carbon fibre in the PLA achieves high heat diffusion. With carbon fibre content of 10%, the heat diffusion ability of the PLA composite is comparable to stainless steel, and with 30% carbon fibre heat diffusion is double that of stainless steel. Mass production of these bioplastic composites is expected by the end of the fiscal year ending March 2009. This is one of the many performance enhancements for PLA, including the use of kenaf as a natural fibre reinforcement that the company has been working on.