INDIAPACK 2006: Focus on packaging materials, machinery and technology

After the roaring success of the INDIAPACK 2004, The Indian Institute of Packaging (a member of World Packaging Organisation) an autonomous body under Ministry of Commerce & Industry, Govt. of India presents INDIAPACK 2006, India's biggest ever Packaging Show to be held at Bombay Exhibition Centre, Goregaon (East), Mumbai during 11-14 December, 2006. The event is supported by Ministry of Commerce & Industries, Ministry of Food Processing Industries, Ministry of Textile, Govt. of India and all the major Packaging Associations including Allied Packaging Industries from India and Abroad, together with Asian Packaging Federation. The participation of Government of Maharashtra as a host State would add value to the Mega Fair. INDIAPACK 2006, envisaged as a catalyst for the development of the Packaging Machinery, Materials, Product Packaging, Conversion, Labelling and allied sectors of the Packaging Industry. The Event is designed to help the Packaging Industry - to keep pace with the growth in changing demand by introducing the latest in packaging technology - high speed machinery and equipments leading to substantial increase in productivity on the one hand and on the other, create a B2B platform for Entrepreneurs, CEOs, Consultants, Sr. Level Officials, Decision makers for meeting the business decisions and forge business deals. The Event offers greater opportunities for paper packaging & corrugated manufacturers from India and abroad to interact on a common platform. This will highlight the corrugated board / box industry in terms of upgrading the production technologies, latest trend and know-how and quality control. The display at INDIAPACK 2006 will highlight the core packaging and growth areas in metal, glass, composite, paper & board plastic, flexible packaging, industry product packing & packaging services. The event is receiving overwhelming response from the industry with about 10,000 sq. mt. of available exhibition space; the hall is divided among the Indian Industry Sectors in addition to international Country Pavilion, for easy access. About 200 exhibitors from 20 Countries are expected to participate in this mega Event. The Event will showcase PACKAGING Paper & Paper Board Corrugated Board and Boxes Glass Containers Metal/ Tin Containers Rigid & Semi-Rigid Plastic Containers Ancillary Materials - Tapes, Straps, Labels, Adhesives etc. Packaging Materials & Systems for Food, Pharmaceuticals, Cosmetics, Toiletries, Industrial Products, Textiles, Handicrafts etc. MACHINERY Product Filling & Packaging Package Printing Film Extrusion Paper & Paper Board Converting Plastic/ Film Converting & Lamination Plastic Bottle/ Pouch Making & Printing Sealing/ Taping/ Strapping & Bundling Thermoforming Shrink/ Stretch Wrapping Seals/Closures Manufactures and other related Machinery used for complementing Packaging CONSUMABLES/ SERVICES Ink & Varnishes Adhesives Coatings and Decorative Materials Package Design and Development Consulting New Technologies Miscellaneous Other Packaging and Allied Product and Services Alongside the Exhibition, the Asian Packaging Conference will be held during 12 &13 December, 2006 at Mumbai to create an atmosphere where Packaging Fraternity can enjoy multiple opportunities for learning best practices in operational strategies and technology innovation. The main objective is to create stronger relationships with packaging producers, suppliers & customers by focusing on the entire supply chain. A powerful business programme will include industry specific seminars by the Associations with presentations by IIP. Corporate Presentations and Executive Round Table Meetings, which are being planned at the Venue, will play an important role in creating an appropriate environment for business and this programme will run throughout the event. A vigorous marketing and promotional programme will ensure both the right kind of Exhibitors and Visitors to the show, from full spectrum of the packaging industry to Government Bodies, from Designers to Distributors, Allied Industries to, importantly the End Users - the quality of visitors will be second to none. The event has been promoted in the KOREAPACK 2006 held at Seoul during March 21-24, 2006 & has received encouraging response from the Korean Packaging Industry. The Presentation will also be done during CHINAPACK 2006 in Beijing PR China during April 18-20, 2006 The event is supported by leading Packaging, Paper, Pharma, Printing, Food & Beverage Industries Trade Journals. For more information/ space booking email to indiapack@tafcon.com ORGANISER Indian Institute of Packaging: IIP is an autonomous body working under Ministry of Commerce & Industry, Govt. of India. Its activities include training and education, consultancy, R & D, testing, and co-operation with international organizations. EXPO ORGANISER TAFCON Projects (India) Pvt. Ltd. A leader in quality management of specialized trade fairs & conferences from conceptualization to completion. The core group having over 5 decades of experience & expertise. In Association with EXPOMEDIA Group Plc. U.K. (PRESS RELEASE)