Ticona unveils new low warpage LCP grade for complex designed high speed connectors

Ticona Engineering Polymers recently announced development of a new low warpage Vectra liquid crystal polymer (LCP) grade - E488i - as part of a strategic expansion of its portfolio of V-0 halogen-free polymers for use in eco-friendly electrical and electronic components. Customer trials and company tests using the new Vectra E488i showed less warpage of intricately designed connectors out of the mold and after reflow soldering, compared to parts molded with other commercially available LCP grades and high temperature nylons. This new grade, which expands the portfolio of Vectra LCP, is designed to meet demanding specifications for electronic components with increased pin densities that enable increased bandwidth and higher speeds. "Our new Vectra low warpage grade, E488i, is designed to improve warpage behavior resulting in flatter molded parts such as CPU sockets and DIMM connectors that must maintain extremely tight dimensional tolerances after lead free reflow soldering temperatures of 260 Celsius," said Edson Ito, Vectra LCP technical marketing manager for Ticona. The company claims that the precise dimensional tolerances and complex meltflow paths required by the new connectors with 200 to 300 pins and sockets with about 1,000 pins can be provided by Vectra LCP low warpage E488i. Vectra LCP, inherently flame resistant without the need for halogenated flame retardant additives, has a ULV-0 rating and is employed to make eco-friendly connectors, bobbins, switches and relays that meet Restriction of Hazardous Substances Directive (RoHS) and European Waste Electrical and Electronic Equipment (WEEE) directives. The company says that Vectra LCP family of high-performance polymers, based on patented Ticona technology, has evolved to include grades that keep pace with market needs for inherent flame resistance, thinner walls, higher temperature resistance, higher production rates, lower overall part costs and recyclability.
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